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      <title>Im happy I finally signed up</title>
      <link>https://www.jdbga.com/thread-177-1-1.html</link>
      <description><![CDATA[You actually said this perfectly!

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      <category>芯片返修焊接</category>
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      <pubDate>Mon, 07 Apr 2025 17:23:59 +0000</pubDate>
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      <category>芯片返修焊接</category>
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      <description><![CDATA[一般的BGA返修及焊接工艺BGA的全称是Ball Grid Array（球栅阵列结构的PCB），它是集成电路采用有机载板的一种封装法。它具有：①封装面积减少②功能加大，引脚数目增多③PCB板溶焊时能自我居中，易上锡④可靠性高⑤电性能好，整体成本低等特点。有BGA的PCB板一般小孔较 ...]]></description>
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